Nobuo Hayasaka
Profile
Performance in office
Tenure
Tenure
Background
Born in 1955, he completed graduate studies at Tohoku University in 1984 and joined Toshiba, building his career in semiconductor process development. He became head of the advanced memory development center in December 2007 and, in October 2013, chief technology executive of the Semiconductor & Storage Products Company and head of its semiconductor R&D center. He moved to the former Toshiba Memory, spun off in April 2017, as Director and Executive Vice President, became chief technology officer in August 2018, and in July 2019 became Representative Director, Executive Vice President and Executive Officer of Kioxia Holdings.
Selection
The first president, Yasuo Naruke, stepped down on January 29, 2020, for medical treatment and died that July. Executive Vice President Nobuo Hayasaka became Representative Director, President and Chief Executive Officer the same day. Stacy Smith, formerly of Intel in the U.S., supported him as chairman.
Initiatives
The listing planned for October 2020 failed to attract buyers even after the indicative price range was lowered to ¥2,800 to ¥3,500 per share, and on September 28 the company announced a postponement. In 2021 Western Digital proposed a share exchange worth about $20 billion, and in 2023 business integration talks revived around a plan to separate the flash business into a new company headquartered in Japan, but shareholder SK hynix did not consent and the talks collapsed in October. In October 2022 the company completed the Yokkaichi Fab 7, built at a cost of about ¥1 trillion. On December 18, 2024, it listed on the Prime Market of the Tokyo Stock Exchange at an offering price of ¥1,455.
Career
Career
Toshiba
| Date | Position |
|---|---|
| Apr 1984 | Joined |
| Jul 2001 | Semiconductor Company, General Manager, Semiconductors Process Development Fifth Department, Process Engineering Promotion Center |
| Oct 2004 | Semiconductor Company, General Manager, Semiconductors Process Development Third Department, Process Engineering Promotion Center |
| Dec 2007 | General Manager, Advanced Memory Development Center, Semiconductor Company |
| Oct 2013 | Head of Semiconductor and Storage Company, Chief Engineer, General Manager, Semiconductors Research and Development Center |
| Jun 2014 | Managing Corporate Executive Officer |
| Mar 2015 | Managing Corporate Executive Officer |
| Oct 2015 | Managing Corporate Executive Officer |
| Apr 2016 | Managing Corporate Executive Officer |
| Jun 2016 | Managing Corporate Executive Officer |
| Jun 2017 | Stepped down as Managing Corporate Executive Officer and Engineering, Toshiba Memory |
Toshiba Memory
| Date | Position |
|---|---|
| Apr 2017 | Executive Vice President |
| Jun 2017 | Stepped down as Executive Vice President |
Toshiba Memory
| Date | Position |
|---|---|
| Aug 2018 | Executive Vice President, Executive Officer and Head of Engineering |
| Jul 2019 | Representative Director, Executive Vice President, Executive Officer and Head of Engineering |
Kioxia Holdings
| Date | Position |
|---|---|
| Jul 2019 | Representative Director, Executive Vice President, Executive Officer |
| Jan 2020 | Representative Director, President, Executive Officer |
| Apr 2026 | Representative Director |
| Apr 2026 | Stepped down as President |
| Jun 2026 | Stepped down as Representative Director |
Kioxia
| Date | Position |
|---|---|
| Jan 2020 | Representative Director, President, Executive Officer |
| Apr 2026 | Representative Director |