{
  "timeline": [
    {
      "date": "1937/5",
      "category": "会社設立",
      "region": "",
      "importance": 3,
      "event": "関家三男が広島県呉で第一製砥所を個人創業",
      "detail": "軍需向けの工業砥石（砲弾研磨用）を製造",
      "significance": "ディスコの起点。海軍工廠から独立した個人事業",
      "source": "有価証券報告書"
    },
    {
      "date": "1940/3",
      "category": "組織再編",
      "region": "",
      "importance": 2,
      "event": "有限会社第一製砥所に組織変更",
      "detail": "",
      "significance": "法人化",
      "source": "有価証券報告書"
    },
    {
      "date": "1953/1",
      "category": "研究開発",
      "region": "",
      "importance": 3,
      "event": "積算電力計磁石向け切断砥石を開発",
      "detail": "1.2mm間隔での磁石切断技術",
      "significance": "「磨く」から「切断する」への領域拡大。切断砥石でシェア100%を確保",
      "source": ""
    },
    {
      "date": "1958/11",
      "category": "組織再編",
      "region": "",
      "importance": 2,
      "event": "有限会社第一製砥所を株式会社に改組",
      "detail": "",
      "significance": "株式会社化",
      "source": "有価証券報告書"
    },
    {
      "date": "1965/1",
      "category": "研究開発",
      "region": "",
      "importance": 3,
      "event": "万年筆ペン先向け0.14mmレジノイド砥石を独自開発",
      "detail": "パイロット社からの依頼。共同開発・開発費援助を断って自社単独で開発",
      "significance": "精密砥石の技術的ブレイクスルー。万年筆業界国内市場を独占",
      "source": ""
    },
    {
      "date": "1968/1",
      "category": "",
      "region": "",
      "importance": 4,
      "event": "半導体製造向け切断砥石の開発を開始",
      "detail": "シリコンウエハー切断への参入",
      "significance": "現在の基幹事業ダイシングソーの起点",
      "source": "有価証券報告書"
    },
    {
      "date": "1969/12",
      "category": "",
      "region": "米州",
      "importance": 3,
      "event": "米国にDISCO ABRASIVE SYSTEMSを設立",
      "detail": "現DISCO HI-TEC AMERICA",
      "significance": "初の海外拠点。米国半導体市場への直接アクセス確保",
      "source": "有価証券報告書"
    },
    {
      "date": "1970/9",
      "category": "",
      "region": "",
      "importance": 3,
      "event": "精密切断装置を開発・販売開始",
      "detail": "ダイシングソーの本格商用化",
      "significance": "半導体装置メーカーへの転換の決定的一歩",
      "source": "有価証券報告書"
    },
    {
      "date": "1975/2",
      "category": "",
      "region": "",
      "importance": 3,
      "event": "半導体用ダイシングソーを開発・販売開始",
      "detail": "精密ダイヤモンド工具への進出",
      "significance": "ダイシングソー＋ダイヤモンド工具の垂直統合",
      "source": "有価証券報告書"
    },
    {
      "date": "1977/4",
      "category": "組織再編",
      "region": "",
      "importance": 2,
      "event": "商号を株式会社ディスコに変更",
      "detail": "",
      "significance": "「第一製砥所」から「ディスコ」へ。半導体装置メーカーとしてのブランド確立",
      "source": "有価証券報告書"
    },
    {
      "date": "1979/2",
      "category": "",
      "region": "東南アジア",
      "importance": 2,
      "event": "シンガポール駐在員事務所を開設",
      "detail": "現DISCO HI-TEC（SINGAPORE）",
      "significance": "東南アジア販売網の起点",
      "source": "有価証券報告書"
    },
    {
      "date": "1979/9",
      "category": "",
      "region": "欧州",
      "importance": 2,
      "event": "スイスにDISCO SEIER AGを共同出資で設立",
      "detail": "Helmut Seier氏との共同出資",
      "significance": "欧州販売網の起点",
      "source": "有価証券報告書"
    },
    {
      "date": "1980/1",
      "category": "",
      "region": "",
      "importance": 3,
      "event": "精密平面研削装置を開発・販売開始",
      "detail": "「削る」領域への本格参入",
      "significance": "「切る・削る」2領域の併走体制確立",
      "source": "有価証券報告書"
    },
    {
      "date": "1980/1",
      "category": "経営計画",
      "region": "",
      "importance": 3,
      "event": "ダイシングソー世界シェア約60%を確立",
      "detail": "TI・モトローラ・フェアチャイルドなど米半導体メーカーに納入",
      "significance": "世界の半導体前工程装置のニッチトップ化",
      "source": "",
      "amount": "世界シェア約60%"
    },
    {
      "date": "1982/3",
      "category": "",
      "region": "欧州",
      "importance": 2,
      "event": "独にDISCO DEUTSCHLAND GmbHを設立",
      "detail": "現DISCO HI-TEC EUROPE",
      "significance": "欧州直販網の自社化",
      "source": "有価証券報告書"
    },
    {
      "date": "1983/1",
      "category": "組織再編",
      "region": "",
      "importance": 2,
      "event": "株式会社ディスコ技研（後のディスコエンジニアリングサービス）を設立",
      "detail": "保守・サービス専業の子会社",
      "significance": "装置売り切りから保守サービス分離体制への移行",
      "source": "有価証券報告書"
    },
    {
      "date": "1983/12",
      "category": "組織再編",
      "region": "",
      "importance": 2,
      "event": "本社を東京都大田区に移転",
      "detail": "隣接地に研究開発拠点として本社工場を新設",
      "significance": "本社機能と開発拠点の集約",
      "source": "有価証券報告書"
    },
    {
      "date": "1984/1",
      "category": "社長交代",
      "region": "",
      "importance": 3,
      "event": "創業者・関家三男が社長退任、関家憲一が第2代社長に就任",
      "detail": "関家臣二が代表取締役副社長に就任。同族経営を継続",
      "significance": "創業から47年での創業者退任。同族経営の第2世代移行",
      "source": ""
    },
    {
      "date": "1984/3",
      "category": "",
      "region": "",
      "importance": 2,
      "event": "産業用ダイヤモンド工具事業へ進出",
      "detail": "",
      "significance": "工具内製化の拡大",
      "source": "有価証券報告書"
    },
    {
      "date": "1989/10",
      "category": "株式上場",
      "region": "",
      "importance": 3,
      "event": "日本証券業協会の店頭売買銘柄として株式公開",
      "detail": "",
      "significance": "初の資本市場公開",
      "source": "有価証券報告書"
    },
    {
      "date": "1990/12",
      "category": "",
      "region": "欧州",
      "importance": 2,
      "event": "DISCO HI-TEC EUROPE GmbHを100%子会社化、欧州本社をスイスから独に移転",
      "detail": "1979年Helmut Seier氏との共同出資から独資化",
      "significance": "欧州販売の自社支配確立",
      "source": "有価証券報告書"
    },
    {
      "date": "1992/3",
      "category": "",
      "region": "",
      "importance": 3,
      "event": "半導体拡散炉事業から撤退、50億円の損失を確定",
      "detail": "半導体需要低迷と重なり最終赤字転落",
      "significance": "「切る・削る・磨く」以外への多角化失敗。以後の事業領域集中の直接の契機",
      "source": "",
      "amount": "撤退損失50億円"
    },
    {
      "date": "1993/1",
      "category": "構造改革",
      "region": "",
      "importance": 2,
      "event": "賃金カット・残業規制・早期退職制度を導入",
      "detail": "1992年赤字転落を受けた経費削減",
      "significance": "創業以来初の本格リストラ",
      "source": ""
    },
    {
      "date": "1994/11",
      "category": "",
      "region": "",
      "importance": 1,
      "event": "精密ダイヤ製造部門でISO9002を取得",
      "detail": "",
      "significance": "半導体顧客の品質要求への対応起点",
      "source": "有価証券報告書"
    },
    {
      "date": "1995/8",
      "category": "",
      "region": "",
      "importance": 1,
      "event": "PS事業部でISO9001を取得",
      "detail": "後に全拠点に拡大",
      "significance": "品質マネジメント体系の確立",
      "source": "有価証券報告書"
    },
    {
      "date": "1996/4",
      "category": "",
      "region": "中国",
      "importance": 3,
      "event": "中国サービス拠点として上海駐在員事務所を開設",
      "detail": "現DISCO HI-TEC CHINA",
      "significance": "中国市場参入の起点。後年の単独最大子会社の母体",
      "source": "有価証券報告書"
    },
    {
      "date": "1997/1",
      "category": "経営計画",
      "region": "",
      "importance": 4,
      "event": "「Disco Values」を制定",
      "detail": "事業領域を「切る・削る・磨く」に限定。経常利益連動の社内通貨（Will制度）を導入",
      "significance": "1992年の失敗を踏まえた事業集中と自律経営の思想化。以後の高収益構造の土台",
      "source": ""
    },
    {
      "date": "1998/2",
      "category": "",
      "region": "",
      "importance": 1,
      "event": "広島事業所（呉・桑畑）でISO14001を取得",
      "detail": "",
      "significance": "環境マネジメント導入",
      "source": "有価証券報告書"
    },
    {
      "date": "1999/12",
      "category": "株式上場",
      "region": "",
      "importance": 3,
      "event": "東京証券取引所市場第一部に上場",
      "detail": "",
      "significance": "本格的な大型資本市場への参画",
      "source": "有価証券報告書"
    },
    {
      "date": "2002/8",
      "category": "",
      "region": "",
      "importance": 2,
      "event": "精密切断装置としてレーザソーを開発・販売",
      "detail": "",
      "significance": "ダイシングソーのレーザー化への進出",
      "source": "有価証券報告書"
    },
    {
      "date": "2003/11",
      "category": "",
      "region": "",
      "importance": 2,
      "event": "全自動グラインダ/ポリッシャ装置を開発・販売",
      "detail": "",
      "significance": "「磨く」工程の自動化装置",
      "source": "有価証券報告書"
    },
    {
      "date": "2004/11",
      "category": "組織再編",
      "region": "",
      "importance": 1,
      "event": "本社・R&Dセンターを東京都大田区大森北に新設・移転",
      "detail": "",
      "significance": "R&D集約体制の更新",
      "source": "有価証券報告書"
    },
    {
      "date": "2005/1",
      "category": "組織再編",
      "region": "",
      "importance": 2,
      "event": "ディスコエンジニアリングサービスを吸収合併",
      "detail": "",
      "significance": "1983年に分離した保守サービスを20年ぶりに再統合",
      "source": "有価証券報告書"
    },
    {
      "date": "2006/8",
      "category": "組織再編",
      "region": "",
      "importance": 1,
      "event": "株式会社ダイイチコンポーネンツを設立",
      "detail": "電動機・電源装置等の電気機械器具を製造",
      "significance": "装置部品の内製化深化",
      "source": "有価証券報告書"
    },
    {
      "date": "2007/8",
      "category": "",
      "region": "東アジア",
      "importance": 3,
      "event": "台湾販売拠点としてDISCO HI-TEC TAIWANを設立",
      "detail": "",
      "significance": "台湾ファウンドリ集積地への直販体制確立",
      "source": "有価証券報告書"
    },
    {
      "date": "2008/6",
      "category": "社長交代",
      "region": "",
      "importance": 2,
      "event": "関家一馬が第3代社長（実質）に就任",
      "detail": "",
      "significance": "自律経営・Will制度運用の本格化の起点",
      "source": "有価証券報告書"
    },
    {
      "date": "2010/1",
      "category": "設備投資",
      "region": "",
      "importance": 1,
      "event": "広島事業所の桑畑工場A棟を建設",
      "detail": "",
      "significance": "",
      "source": "有価証券報告書"
    },
    {
      "date": "2010/6",
      "category": "設備投資",
      "region": "",
      "importance": 2,
      "event": "長野県茅野市に茅野工場A棟を建設",
      "detail": "",
      "significance": "国内生産拠点の分散化",
      "source": "有価証券報告書"
    },
    {
      "date": "2010/1",
      "category": "経営計画",
      "region": "",
      "importance": 3,
      "event": "ダイシングソー世界シェア約70%まで拡大",
      "detail": "アジア（台湾・韓国・中国）半導体産業の生産シフトに対応",
      "significance": "半導体前工程ニッチトップ地位の固定化",
      "source": "",
      "amount": "世界シェア約70%"
    },
    {
      "date": "2012/5",
      "category": "",
      "region": "",
      "importance": 2,
      "event": "本社・広島事業所でISO22301（事業継続マネジメント）取得",
      "detail": "東日本大震災後のBCP整備",
      "significance": "半導体装置サプライチェーンとしてのBCP明文化",
      "source": "有価証券報告書"
    },
    {
      "date": "2012/6",
      "category": "設備投資",
      "region": "東南アジア",
      "importance": 1,
      "event": "DISCO HI-TEC Singapore One-Stop Solution Centerを建設",
      "detail": "シンガポール拠点の新社屋",
      "significance": "東南アジアサービス機能集約",
      "source": "有価証券報告書"
    },
    {
      "date": "2018/4",
      "category": "設備投資",
      "region": "",
      "importance": 2,
      "event": "長野事業所を開設",
      "detail": "",
      "significance": "国内第2生産拠点の本格稼働",
      "source": "有価証券報告書"
    },
    {
      "date": "2022/3",
      "category": "設備投資",
      "region": "",
      "importance": 2,
      "event": "羽田R&Dセンターを開設",
      "detail": "",
      "significance": "首都圏R&D体制の拡大",
      "source": "有価証券報告書"
    },
    {
      "date": "2022/4",
      "category": "株式上場",
      "region": "",
      "importance": 1,
      "event": "東証プライム市場へ移行",
      "detail": "",
      "significance": "",
      "source": "有価証券報告書"
    },
    {
      "date": "2024/4",
      "category": "設備投資",
      "region": "",
      "importance": 2,
      "event": "羽田R&Dセンター新棟の建替を決定",
      "detail": "投資額約128億円。既存棟解体費含む。着工2025年4月・竣工2027年3月予定",
      "significance": "FY23に羽田既存棟の減損損失75億円計上。R&D拠点の更新投資",
      "source": "決算説明会資料（FY23 4Q）",
      "amount": "投資額128億円"
    },
    {
      "date": "2025/3",
      "category": "設備投資",
      "region": "",
      "importance": 2,
      "event": "研究開発用不動産を約500億円で取得",
      "detail": "FY24設備投資額は過去最大。技術購入予備費から2期に分けて取り崩し",
      "significance": "R&D設備拡張のための土地確保",
      "source": "決算説明会資料（FY24 4Q）",
      "amount": "取得額約500億円"
    },
    {
      "date": "2025/4",
      "category": "設備投資",
      "region": "",
      "importance": 3,
      "event": "広島事業所に新工場の建築を決定",
      "detail": "生産体制増強のため。FY25以降も年間300億円超の設備投資を継続見通し",
      "significance": "生成AI需要を受けた国内生産能力増強。国内3拠点集中の継続",
      "source": "決算説明会資料（FY24 4Q）"
    }
  ]
}